Electron Fluoride Solution
Advantages
- Higher boiling point than most CFCs, HCFCs and HFCs, reducing evaporative losses
- Low surface tension, low viscosity and strong wettability
- Excellent heat transfer ability
- Good insulation performance
- Chemical and thermal stability
- High voltage shock resistance makes it a cooling medium for EMU traction transformers
Use in heat transfer application and semiconductor manufacturing
High compatibility with a variety of materials make it ideal for use in liquid cooling working medium component in semiconductor manufacturing processes, such as semiconductor dry etching, wafer testing and packaging testing.
Its chemical and thermal stability, nonflammability and low toxicity make it useful for other industrial applications such as specialty solvent and heat transfer applications.
Passed SGS testing and IPCC requirements
WFC electronic fluorinated fluid has passed the SGS test and does not contain CI, Br and other elements. The ODP value (ozone depleting potential) of the product is zero, and the result complies with the EU RoHS Directive 2002/95/EC, the revised Directive 2011/65/EU Appendix II Restriction Requirements.
WFC electronic fluorinated fluid has its special structure. According to the requirements of IPCC, it is determined that the product has a low global greenhouse effect value, which meets the international requirements for such products.
WFC electronic fluorinated fluid has its special structure. According to the requirements of IPCC, it is determined that the product has a low global greenhouse effect value, which meets the international requirements for such products.
Advantages
No damage to electronic components and circuits
Environmentally friendly and clean
No damage to electronic precision equipment
It has a certain solubilization capacity for flux and oil
Good insulation performance
Physical Properties and Application
| Appearance | Colorless |
| Boiling Point (1 atm) | 47°C |
| Liquid Density(25°C) | 1.60 |
| Saturation vapor pressure (kPa) (25 °C) | 35.38 |
| Latent heat of vaporization | 95.66kJ/kg |
| Kinematic Viscosity (25°C) | 0.379mm2/s |
| Surface Tension | 11.441mN/m |
| Volume Resistivity | ≧1*10^14Ω· mm |
| Acute inhalation toxicity LC50 | 22174.07mg/m3 |
| Odor | Odorless |
| Flash point: | None |
| Specific Heat | 1.2787 J·g^-1 ·K^-1 |
| Dielectric Strength (2.5 mm) | 43.4KV |
| Freezing point | -117.0 ℃ |
| Thermal Conductivity (25 °C) | 0.0489 W/(m∙K) |
| Dielectric Loss | 0.0016 |
| GWP | 20 |
| ODP | 0 |
- Heat transfer cooling medium for semiconductor dry etching, wafer testing, packaging, etc.
- In-line cleaning equipment, insulating fluid.
- Electronic precision cleaning, optical cleaning, dehydration cleaning.
- As an intermediate to synthesize fluorinated surfactants and other fluorinated chemicals.
- Hydraulic transmission fluid
- Attenuant, lubricant thinner, Solvents, etc.
| Appearance | Colorless |
| Liquid Density（25℃） | 1.757 g·mL-1 |
| Flash Point | No |
| Thermal Conductivity (25 ℃) | 0.0608 W∙m-1∙K-1 |
| Kinematic Viscosity (25 ℃) | 0.7772 mm^2·s^-1 |
| Dielectric Strength (2.5 mm） | ＞35.5 kV |
| Dielectric Loss (1 MHz） | 0.00056 |
| Ozone Depletion Potential | 0 |
| Odor | Odorless |
| Boiling Point (1 atm) | 75 ℃ |
| Ignition Point | No |
| Specific Heat (25 ℃) | 1.223 J·g-1·K-1 |
| Surface Tension | 14.04 mN·m-1 |
| Dielectric Constant (1 MHz) | 2.07 |
| Volume Resistivity (25 ℃) | 2.994×10^15 Ω·mm |
| GWP | <120 |
- Heat transfer fluid, cooling medium
- Electric cleaning equipment, insulation fluid
- Electronic precision cleaning, optical cleaning, dehydration cleaning
- Hydraulic transmission fluid, electronic equipment seal isolation fluid
- Solvent diluent, lubricant diluent, special purpose solvent, etc
| Appearance | Colorless |
| Boiling Point (1 atm) | 110℃～115℃ |
| Liquid Density (25°C) | 1.815g/mL |
| Surface Tension | 15mN/m |
| Saturation vapor pressure (kPa) (20 °C) | 3.019kPa |
| Latent heat of vaporization | 82.05kJ/kg |
| Odor | Odorless |
| Molecular weight | 450 |
| Flash point | None |
| Specific Heat (25℃) | 1.1768 J/(g•K) |
| Kinematic Viscosity (25°C) | 1.353mm2/s |
| Dielectric Strength (2.5 mm) | 1.79 |
| Dielectric Loss (1MHz) | 0.00046 |
| Volume Resistivity (25℃) | 2.484×1015Ω·mm |
| Freezing point | -109.67℃ |
- Heat transfer cooling medium for semiconductor dry etching, wafer testing, packaging, etc.
- In-line cleaning equipment, insulating fluid.
- Electronic precision cleaning, optical cleaning, dehydration cleaning.
- As an intermediate to synthesize fluorinated surfactants and other fluorinated chemicals.
- Hydraulic transmission fluid
- Attenuant, lubricant thinner, Solvents, etc.
| Appearance | Colorless |
| Boiling Point (1 atm) | 124.4 ℃ |
| Liquid Density (25°C) | 1.855 g·mL^-1 |
| Saturation Vapor Pressure (kPa) (20 °C) | 1.516 kPa |
| Kinematic Viscosity (25°C) | 1.376 mm2·s^-1 |
| Thermal Conductivity (25 °C) | 0.0614 W∙m^-1∙k^-1 |
| Dielectric Strength (2.5 mm) | ＞35.7 kV |
| Dielectric Loss (1 MHz) | 0.00029 |
| Critical Temperature | 196.54 ℃ |
| ODP | 0 |
| Odor | Odorless |
| Freezing point | -82 ℃ |
| Flash Point | None |
| Latent heat of vaporization | 82.8 kJ·kg-1 |
| Specific Heat (25 ℃) | 1.107 J·g-1·K-1 |
| Surface Tension | 15.69 mN·m-1 |
| Dielectric constant (1 MHz) | 2.09 |
| Volume Resistivity (25 ℃) | ≥1×1015 Ω·mm |
| Critical pressure | 4.28 MPa |
| GWP | 108 |
- Heat transfer cooling medium for semiconductor dry etching, wafer testing, packaging, etc.
- In-line cleaning equipment, insulating fluid.
- Electronic precision cleaning, optical cleaning, dehydration cleaning.
- As an intermediate to synthesize fluorinated surfactants and other fluorinated chemicals.
- Hydraulic transmission fluid
- Attenuant, lubricant thinner, Solvents, etc.
| Appearance | Colorless |
| Boiling point (1 atm) | 160°C |
| Liquid density (25°C) | 1.806g/ml |
| Dielectric loss (10 MHz) | 0.00418 |
| Refractive index | 1.308 |
| Kinematic viscosity (25°C) | 3.05 mm^2·s^-1 |
| Thermal conductivity (25°C) | 0.0656 W∙m^-1∙K^-1 |
| Dielectric strength (2.5 mm) | >50.4 kV |
| ODP | 0 |
| Odor | Odorless |
| Freezing point | -84 ℃ |
| Flash point | No |
| Volume resistivity | ≥1.579×10^11 Ω·mm |
| Coefficient of volume expansion (25 °C) | 5.420×10^-3 |
| Specific Heat | 1.151 J∙g^-1∙K^-1 |
| Surface Tension | 17.51 mN·m^-1 |
| Dielectric Constant (1 MHz) | 4.75 |
| GWP | 180 |
- Heat transfer cooling medium for semiconductor dry etching, wafer testing, packaging, etc.
- In-line cleaning equipment, insulating fluid.
- Electronic precision cleaning, optical cleaning, dehydration cleaning.
- As an intermediate to synthesize fluorinated surfactants and other fluorinated chemicals.
- Hydraulic transmission fluid
- Attenuant, lubricant thinner, Solvents, etc.
| KB | 10 |
| Boiling Point | 61 ℃ |
| Flash Point | 無 |
| Vapor Pressure (25 °C) | 27 kPa |
| Thermal Conductivity (25 °C) | 0.069 W∙m^-1∙K^-1 |
| Kinematic Viscosity (25 °C) | 0.38 mm2·s^-1 |
| Dielectric Strength (2.5 mm) | 40 kV |
| ODP | 0 |
| Liquid Density (25 ℃) | 1.51 g·mL^-1 |
| Freezing point | -135 ℃ |
| Autoignition Temperature | 405 ℃ |
| Latent heat of vaporization | 112 kJ·kg^-1 |
| Specific Heat (25 °C) | 1.183 J·g^-1·K^-1 |
| Surface Tension | 13.6 mN·m^-1 |
| Dielectric Constant (1 MHz) | 7.4 |
- Solvent for anti-fingerprint coating such as electronic display screen
- Cleaning agent for electronic products
- Cosmetic wetting agent
- Heat transfer cooling medium for semiconductor dry etching, wafer testing, packaging, etc
| Appearance | Colorless, Transpare |
| Molecular Mass | 264 |
| Boiling Point(1 atm) | 76 ℃ |
| Flash Point | No |
| Vapor Pressure(25 °C) | 14.53 kPa |
| Surface Tension | 13.6 mN·m^-1 |
| ODP | 0 |
| Odor | Faint odour |
| Liquid Density | 1.42 g·mL^-1 |
| Freezing point (1 atm) | -138 ℃ |
| Autoignition Temperature | 375 ℃ |
| Kinematic Viscosity (25 °C) | 0.4 mm2·s^-1 |
| Flammability Range in Air | 2.4-12.4% |
- Cold cleaner (flex circuits, wipe solvent)
- Cleaning and rinsing agent for vapor degreasing
- Light-duty cleaning (neat)–particulates, fluorolubes, light oils, fluoropolymers
- Lubricant carrier Fluorocarbons Hydrocarbons Silicones
- Specialty solvents, dispersion medium, reaction medium, extraction solvent
- Spray contact cleaner
- CFC, HCFC, HFC and PFC replacement agent
- Heat Transfer Fluid
| Appearance | Colorless |
| Boiling Point (1 atm) | 100.5 ℃ |
| Liquid Density(25 °C) | 1.656 g·mL^-1 |
| Critical Temperature | 205 ℃ |
| Vapor Pressure (20 °C) | 4.5 kPa |
| Dielectric Loss (1 MHz) | 0.00037 |
| Kinematic Viscosity (25°C) | 0.7214 mm2·s^-1 |
| Thermal Conductivity (25°C) | 0.062 W∙m^-1∙K^-1 |
| Coefficient of Volume Expansion(25 °C) | 14.60×10^-6 |
| Dielectric Strength (2.5 mm) | ＞25.3 kV |
| ODP | 0 |
| Odor | Odorless |
| Freezing point | -79.95 ℃ |
| Flash Point | No |
| Critical Pressure | No date |
| Latent heat of vaporization | 97.99 kJ·kg^-1 |
| Volume Resistivity | ≥1.221×10^11 Ω·mm |
| Specific Heat | 1.199 J·g^-1·K^-1 |
| Surface Tension | 15.01 mN·m^-1 |
| Refractive Index | 1.279 |
| Dielectric Constant (1 MHz) | 7.16 |
| GWP | 200 |
- Cleaning agent, bleaching agent, anhydrous fluid, flux remover and heat transfer media
- Cleaning electronic instrument and laser disc, removal of particles and debris
- Cleaning optical system, precision parts, precision electronic instruments, and medical equipment
- Solvent diluent, lubricant diluent, special purpose solvent, etc
Boiling Point （1 atm） | 128 ℃ |
Liquid Density（25 ℃） | 1.614 g·mL^-1 |
Kinematic Viscosity（25℃） | 0.77 mm^2·s^-1 |
Dielectric Strength（2.5 mm） | ≥35 kV |
| ODP | 0 |
Freeze point | -100 ℃ |
Flash Point | No |
Surface Tension（25℃） | 16.2 mN·m^-1 |
Dielectric Constant | 5.8 |
- Can be used in cooling of ion implanters, dry etchers and CVD machines in emiconductor and flat panel display manufacturing facilities.
- Can be used to cool semiconductor thermal shock and test equipment.
- Can be used in direct contact single- and two-phase cooling of supercomputers and sensitive military electronics, and to cool high voltage transformers and power electronics.
- Can be used as an alternative to commonly used fluids in pharmaceutical and chemical manufacturing processes, such as freeze drying and reactor cooling.
Contact Us
wyeast@ms69.hinet.net
Fax
886-4-23053542
Phone
886-4-23058511